13.08.2012 h2a1 - h92 0 1 / 4 h2a1 - h92 0 high power single chip led h2a1 - h92 0 i s a gaalas based, high power 92 0 nm single chip led in standard hexagonal aluminum package for general application. slots in the aluminum - core pcb allow for easy mounting of standard collimating optics and are also suitable for m3 or m4 mounting screws. large electrical interconnection pads on the pcb allow for convenient installation. specifications ? struct ure: gaalas ? peak wavelength: 92 0 nm ? optical output powe r: typ. 75 mw ? life time: > 10.000 hou rs ? lead free product - rohs compliant absolute maximum ratings (t a =25c) parameter symbol value unit power dissipation, dc p d 1000 mw forward current, dc i f 500 ma pulsed current (1% duty cycle, 1khz) i fp 1000 ma reverse voltage u r - 5 v operati ng temperature t opr - 30 ? +70 c storage temperature t stg - 30 ? +85 c soldering temperature (max. 1,5 s) t sol 330 c electro - optical characteristics (t a =25c) parameter symbol condition min. typ. max. unit forward current i f - 350 - ma viewing a ngle i f = 350 ma 75 d eg. cw output power p o i f = 350 ma 75 mw peak wavelength p i f = 350 ma - 92 0 - nm forward voltage u f i f = 350 ma - 1.3 - v half width (fwhm) ? i f = 350 ma - 50 nm rise time t r i f = 350 ma 400 ns fall time t f i f = 350 ma 400 ns wavelength measurements tolerance is +/ - 2% output power measurement tolerance is +/ - 10% voltage measurement tolerance is +/ - 2% device materials item material foundation plastic lens acryl electrodes agcu pcb al
13.08.2012 h2a1 - h92 0 2 / 4 typical performance characteristics norm alized o utput p ower vs. wavelength : outline dimensions emitter:
13.08.2012 h2a1 - h92 0 3 / 4 radiation pattern (lambertian lens without optics) relative intensity vs. angular displacement accessories collimating optics, holders, reflectors 10158 + 10146, 2 half angle spot optic + optic holder 10048 + 10076, 4 half angle spot optic + optic holder 10003 + 10043, 6 half angle spot optic + optic holder 10003/15 + 100 43, 15 half angle spot optic + optic holder 10003/25 + 10043, 25 half angle spot optic + optic holder clp17cr, 6 metalized polycarbonate reflector clp23cr, 20 metalized polycarbonate reflector static electrici ty leds are very sensitive to static electricity and surge voltage. it is recommended to wear a wristband or an anti - electrostatic glove whenever handling the leds all devices, equipement, and machinery that is used when handling the leds must be gro unded properly. heat generation it is advised to operate these leds at a reasonable low temperature for long lifetime and stability. high operating temperature will result in premature degradation and shortened lifetime.
13.08.2012 h2a1 - h92 0 4 / 4 soldering condition s reflow soldering: apg2c1 leds have a maximum storage temperature of 85. therefor it is not possible to use a reflow soldering process for array assembly! hot bar soldering: a hot bar soldering process is recommended when soldering apg2c1 emitters. this process will only transfer heat to the leads and avoids overheating the emitter which will damage the device. in order to transfer sufficient heat from the hot bar to the device, following parameters must be carefully considered: ? amount of flux ? press ing force of solder tip ? hot bar temperature for the standard assembly process, following parameters should be maintained: ? hot bar temperature: 330 c ? force of hot bar. 40 n ? soldering time: 1.5 s it is recommended to use a copper nickel - plated hot bar mount ed to standard temperature controlled soldering equipment. manual hand soldering: for prototype build or small series production runs, it is possible to place and solder the emitters by hand. it is therefor e recommended to maintain the following parameters : ? solder tip temperature 330 c ? soldering time. < 1.5 s ? junction temperature must be kept below 70 c a visual inspection may be used t o check the quality of the solder joint general soldering precautions: ? mechanical stress, shock and vibration must be a voided during soldering ? only use non corrosive flux. ? do not apply current to the device until it has cooled down to room temperature after soldering.
|
